
Esprit has an extensive PCBA capability including Surface Mount, Thru-Hole and Mixed Technology able to meet the most complex designs and manufacturing requirements across a wide range of demanding applications and market sectors.
In addition to our Surface Mount capability, our continued investment brings a high level of automation to production ensuring best practice of manufacture, reduced cycle times and reliability in process and product conformity.
Surface Mount Assembly
- 0201 packages
- BGA/uBGA’s
- CSP’s
- LGA’s
- Forced Convection reflow
- Intrusive Reflow (Paste In Hole)
- Leaded and/or Lead Free Process
Thru-Hole Assembly
- Automated Spade Insertion
- Flow Line Staged Insertion
- Press Fit Connectors
- Wave soldering
- Selective soldering
- Leaded or Lead Free Process